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Mobile Phone Shell Polishing Machine

Illustration :

This device realizes automatic polishing and cleaning of the surface of mobile phone products through the speed and position control of frequency conversion and servo.

Schematic Diagram

Basic Parameter

CT: 5s
Operation rate: 98%
Product qualification rate: 100%
Voltage: 220V
Air pressure: 0.5Mpa
Dimensions: Length * Width * height =1200*800*1750 (mm)

Standard Configuration

PLC: Mitsubishi

Optional Configuration

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Equipment Characteristics

Cutting sewage pump can grind and cut large size of polished and cleaned sewage, and achieve purification and reuse of sewage with four-level filter;
The step sedimentation design is used to separate large solid particles;
Multistage variable speed motor drives the cloth wheel to polish the product surface;
Customized explosion-proof cabinet and overflow water curtain to ensure the safety of polishing conditions.

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